FBI:到2028年,粘合剂和密封剂市场将达到 874.7 亿美元


FBI:到2028年,粘合剂和密封剂市场将达到 874.7 亿美元

DELO has developed one-component DELO KATIOBOND FA epoxy adhesives. The adhesives are specially developed for flow activation.

  The patented DELO KATIOBOND FA adhesives are equipped with two different initiators that react to different wavelengths and initiate curing. The optional light fixation step is only possible with this so-called dual-initiator system. The adhesives are available with different mechanical properties and, when cured, have high media and temperature resistance.

  CO2-reduced Process Design

  "With flow activation, we have developed a complete system consisting of process technology, adhesive and device that enables innovations on the customer side," said Dr. Karl Bitzer, Head of product management at DELO. "The various, individually adjustable parameters open up completely new possibilities in terms of component design and efficient and CO2-reduced process design," said Bitzer.

  Flow activation is particularly suitable for bonding and potting temperature-sensitive components. Sensors or connectors, for example, can be bonded gently and with little stress using dual-initiator adhesives. None of the components has to be translucent and the adhesive hardens reliably even in complex geometries.

  Suitable for Sensitive Electronic Components

  With flow activation, DELO has developed a process technology in which the dosing and pre-activation of the adhesive take place in one process step for the first time. This gives users new options for designing their products and processes while at the same time reducing their costs and CO2 emissions. The new technology is particularly suitable for bonding and potting temperature-sensitive electronic components and offers an alternative to the bonding processes previously used in industry.

 The novelty of flow activation is that the adhesive is already exposed during dosing. As a result, the curing reaction starts even before the adhesive hits the component. After the combined process step, the components can be joined.

  Another special feature of the technology is the exposed adhesive areas can also be exposed and fixed after joining. This achieves immediate initial strength and prevents the adhesive from flowing out or the components from slipping. The component can thus be further processed directly. Whether with or without the additional light fixation: The adhesive hardens reliably to its final strength without any further process step - even in undercuts and shadowed areas.

  Flow activation can replace various bonding processes common in the industry. It is an efficient and environmentally friendly alternative to heat-curing, room-temperature-curing or dual-curing processes, can solve previous limitations and creates space for innovations.